Light-emitting device package and method of manufacturing the same

ABSTRACT

Provided are a light-emitting device package and a method of manufacturing the same. The light-emitting device package may include a plurality of light-emitting chips on one substrate (board). The plurality of light-emitting chips may produce colors around a target color. The target color may be produced by combinations of the colors of light emitted from the plurality of light-emitting chips. The colors around the target color may have the same hue as the target color and have color temperatures different from that of the target color. The plurality of light-emitting chips may have color temperatures within about ±250K of that of the target color.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of Korean Patent Application No.10-2010-0134910, filed on Dec. 24, 2010, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein in itsentirety by reference.

BACKGROUND

1. Field

The present disclosure relates to light-emitting device packages andmethods of manufacturing the same.

2. Description of the Related Art

Light-emitting devices such as light emitting diodes (LEDs) and laserdiodes (LDs) utilize an electroluminescence phenomenon, that is, aphenomenon in which light is emitted from a material (semiconductor) byapplying a current or voltage to the material. Light may be emitted froman active layer (i.e., light-emitting layer) due to combinations ofelectrons and holes within the active layer, and the light may haveenergy corresponding to an energy band gap of the active layer.

A light-emitting chip may be mounted on a substrate, and then, afluorescent layer may be coated on the light-emitting chip tomanufacture a light-emitting device package. However, it is difficult toreduce a color variation between signal chip packages in a typicalmethod in which the single chip packages are manufactured and arearrayed. Thus, a defective proportion may be increased. In addition, arigorous production management may be required, process efficiency maybe reduced, and production yield may be decreased. That is to say, sinceit is difficult to reduce the color variation between light-emittingchips due to variations/errors occurring in manufacturing processesaccording to the typical method, productivity may be reduced.

SUMMARY

Provided are light-emitting device packages which reduce a colorvariation and improve productivity.

Provided are methods of manufacturing the light-emitting devicepackages.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to an aspect of the present invention, a light-emitting devicepackage includes a substrate; and a plurality of light-emitting chipsdisposed on the substrate, wherein the plurality of light-emitting chipsproduce colors around a target color, and the colors around the targetcolor have the same hue as the target color and color temperaturesdifferent from that of the target color, wherein the target color isproduced by combinations of the colors of light emitted from theplurality of light-emitting chips.

The plurality of light-emitting chips may have color temperatures withinabout ±250K of that of the target color.

The target color may be a color corresponding to a central portion of apredetermined rank region.

At least four light-emitting chips may be provided.

The plurality of light-emitting chips may be arranged in a checkerboardpattern form.

The plurality of light-emitting chips may be arranged in an N×N matrix,where N is a natural number equal to or greater than two.

Each of the plurality of light-emitting chips may include an independentfluorescent layer.

The light-emitting device package may be a white light-emitting devicepackage.

According to another aspect of the present invention, a method ofmanufacturing a light-emitting device package includes forming a lightemitting structure layer including a plurality of light-emitting cellregions on a wafer; forming a fluorescent layer covering the pluralityof light-emitting cell regions on the wafer; separating the wafer onwhich the plurality of light-emitting cell regions and the fluorescentlayer are formed into a cell unit to form a plurality of light-emittingchips; classifying the plurality of light-emitting chips according tocolor temperatures thereof; and selecting a plurality of chips among theplurality of light-emitting chips and packaging the selectedlight-emitting chips on a substrate, wherein the selected light-emittingchips produce colors around a target color.

The selected light-emitting chips may have color temperatures withinabout ±250K of that of the target color.

The target color may be a color corresponding to a central portion of apredetermined rank region.

At least four light-emitting chips may be selected to be packaged on thesubstrate.

The selected light-emitting chips may be arranged on the substrate in acheckerboard pattern form.

The plurality of light-emitting chips may be white light-emitting chips.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings of which:

FIG. 1 is a plan view of a light-emitting device package according to anembodiment;

FIGS. 2 to 4 are color coordinates illustrating examples of arelationship between colors of light emitted from a plurality oflight-emitting chips and a target color in the light-emitting devicepackage of FIG. 1.

FIGS. 5 and 6 are plan views of a light-emitting device packageaccording to another embodiment;

FIGS. 7A to 7D are views illustrating a method of manufacturing alight-emitting device package, according to an embodiment; and

FIG. 8 is a plan view of FIG. 7A.

DETAILED DESCRIPTION

Various example embodiments will now be described more fully withreference to the accompanying drawings in which example embodiments areshown.

It will be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present. As used herein the term “and/or” includesany and all combinations of one or more of the associated listed items.

It will be understood that, although the terms “first”, “second”, etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another element, component, region, layer or section. Thus,a first element, component, region, layer or section discussed belowcould be termed a second element, component, region, layer or sectionwithout departing from the teachings of example embodiments.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises” and/or “comprising,” when used in this specification,specify the presence of stated features, integers, steps, operations,elements, and/or components, but do not preclude the presence oraddition of one or more other features, integers, steps, operations,elements, components, and/or groups thereof.

Example embodiments are described herein with reference tocross-sectional illustrations that are schematic illustrations ofidealized embodiments (and intermediate structures) of exampleembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, example embodiments should not be construed aslimited to the particular shapes of regions illustrated herein but areto include deviations in shapes that result, for example, frommanufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the figures are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to limit the scope ofexample embodiments.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which example embodiments belong. Itwill be further understood that terms, such as those defined incommonly-used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand will not be interpreted in an idealized or overly formal senseunless expressly so defined herein.

Hereinafter, a light-emitting device package and a method ofmanufacturing the same according to an embodiment will be described indetail with reference to the accompanying drawings. In the figures, thedimensions of layers and regions are exaggerated for clarity ofillustration. Like reference numerals refer to like elements throughout.

FIG. 1 is a plan view of a light-emitting device package according to anembodiment.

Referring to FIG. 1, a plurality of light-emitting chips, e.g., fourlight-emitting chips 200 a to 200 d may be disposed on a substrate 100.The substrate may be a printed circuit board (PCB) substrate. Thelight-emitting chips 200 a to 200 d may include light-emitting cells 20a to 20 d and fluorescent layers 30 a to 30 d covering thelight-emitting cells 20 a to 20 d, respectively. The light-emittingchips 200 a to 200 d may be chips producing colors around apredetermined target color. The colors around the target color may beequal to the target color in hue, but different from the target color incolor temperature. For example, the plurality of light-emitting chips200 a to 200 d may have a color temperature within about ±250K of thatof the target color. A color temperature relationship between the colorsof light emitted from the light-emitting chips 200 a to 200 d and thetarget color will be described later in detail. The light-emittingdevice package may produce the target color by combinations of thecolors of light emitted from the light-emitting chips 200 a to 200 d.Although each of the light-emitting chips 200 a to 200 d has a colortemperature which is somewhat away from that of the target color, thetarget color may be realized by the combinations of the colors of lightemitted from the light-emitting chips 200 a to 200 d, which will bedescribed later in detail.

The light-emitting chips 200 a to 200 d may be arranged in acheckerboard pattern form. For example, the light-emitting chips 200 ato 200 d may be arranged in a 2×2 matrix. However, the number oflight-emitting chips may be increased to more than four. In this case,the light-emitting chips may be arranged in a 3×3 or 4×4 matrix. Thatis, the light-emitting chips may be arranged in an N×N matrix, where Nmay be a natural number equal to or greater than two.

For example, the light-emitting device package of FIG. 1 may be a whitelight-emitting device package. In this case, the light-emitting cells 20a to 20 d may be blue light-emitting cells. The fluorescent layers 30 ato 30 d may be layers formed of a yellow fluorescent material.Alternatively, the light-emitting cells 20 a to 20 d may be ultravioletray emitting cells, and the fluorescent layers 30 a to 30 d may belayers in which RGB (red, green, and blue) fluorescent materials aremixed. The light-emitting cells 20 a to 20 d and the fluorescent layers30 a to 30 d may be combined with each other to generate white light.However, colors of light emitted from the light-emitting cells 20 a to20 d and colors of the fluorescent layers 30 a to 30 d are not limitedto the above-described embodiment. If the white light is emitted by thecombinations of the light-emitting cells 20 a to 20 d and thefluorescent layers 30 a to 30 d, the colors of the two elements may bevariously changed. Also, the light-emitting device package according toan embodiment may emit light of a color different from the white color.

Although not shown in FIG. 1, an encapsulation material covering thefluorescent layers 30 a to 30 d may be further disposed on the substrate100, and then, a lens may be disposed on the encapsulation material. Theencapsulation material may include silicon containing a dispersingagent, for example.

FIGS. 2 to 4 are color coordinates illustrating examples of arelationship between colors of light emitted from a plurality oflight-emitting chips and a target color in the light-emitting devicepackage of FIG. 1. In FIGS. 2 to 4, the light-emitting device packageaccording to an embodiment emits white light.

Referring to FIG. 2, a white region in the color coordinate may bedivided into a plurality of rank regions R1 to R8. The plurality of rankregions R1 to R8 have the same color (hue) as each other, but have colortemperatures and brightnesses different from each other. That is, thewhite region in the color coordinate may be divided into the pluralityof rank regions R1 to R8 according to a color temperature andbrightness. The target color described in FIG. 1 may be a centralportion C0 of a predetermined rank region R5, and the plurality oflight-emitting chips 200 a to 200 d may be chips respectively producingfirst, second, third, and fourth colors C1, C2, C3, and C4 around thetarget color C0 (i.e., the central portion of the rank region R5). Theplurality of light-emitting chips 200 a to 200 d may correspond to thesurrounding colors C1 to C4 respectively. The surrounding colors C1 toC4 corresponding to the plurality of light-emitting chips 200 a to 200d, respectively, may be spaced from the target color C0 with similardistances.

As described above, when the light-emitting device package isconstituted by a multi-chip package, an intermediate color of the colorsC1 to C4 respectively produced by the plurality of light-emitting chips200 a to 200 d, i.e., the target color C0, may be generated. Althougheach of the plurality of light-emitting chips 200 a to 200 d has a colortemperature which is somewhat away from that of the target color C0,since the target color C0 may be realized by the combinations of thecolors of light emitted from the plurality of light-emitting chips 200 ato 200 d, problems of the color variation between the chips may besolved. Therefore, the desired color may be easily realized.Furthermore, since chips classified as defective chips in a related artmay be used as good chips, a defective proportion may be reduced andproduction yield may be increased.

Specifically, the first color C1 and the third color C3 of thesurrounding colors C1 to C4 corresponding to the plurality oflight-emitting chips 200 a to 200 d may face each other (symmetricrelation) with respect to the target color C0, and the second color C2and the fourth color C4 may face each other (symmetric relation) withrespect to the target color C0. Also, when a diamond shaped region (or asemi-diamond shaped region) is defined within about ±250K with respectto the central target color C0, the surrounding colors C1 to C4 maycorrespond to apexes of the diamond shaped region (or a semi-diamondshaped region) or four colors disposed at about the apexes. When thiscondition is satisfied, the target color C0 may be easily realized bythe plurality of light-emitting chips 200 a to 200 d.

The colors (positions) of the light-emitting chips 200 a to 200 ddescribed with reference to FIG. 2 are exemplary merely. Thus, thecolors (positions) may be variously changed, as described as followswith reference to FIGS. 3 and 4.

Referring to FIG. 3, if the colors C1 to C4 around the central portionC0 of the rank region R5 are referred to as first group colors C1 to C4,second group colors C1′ to C4′ may be disposed between the first groupcolors C1 to C4. The plurality of light-emitting chips 200 a to 200 d ofFIG. 1 may produce the first group colors C1 to C4. Alternatively, theplurality of light-emitting chips 200 a to 200 d may produce the secondgroup colors C1′ to C4′. Also, in some cases, three of the plurality oflight-emitting chips 200 a to 200 d may produce three of the first groupcolors (three of C1 to C4), and the remaining one of the plurality oflight-emitting chips 200 a to 200 d may produce one of the second groupcolors (one of C1′ to C4′). In this case, the remaining one color mayproduce a color adjacent to the non-selected color of the first groupcolors C1 to C4. For example, three of the plurality of light-emittingchips 200 a to 200 d may produce colors corresponding to the first groupcolors C1, C2, and C3, and the remaining one may produce a colorcorresponding to the second group color C3′ or C4′.

Referring to FIG. 4, third and fourth group colors C11 to C14 and C11′to C14′ may be disposed at positions further away from the target colorC0 than the above-described first and second group colors C1 to C4 andC1′ to C4′. The plurality of light-emitting chips 200 a to 200 d of FIG.1 may be chips having the third group colors C11 to C14 or chips havingthe fourth group colors C11′ to C14′. Alternatively, three of theplurality of light-emitting chips 200 a to 200 d may produce three ofthe third group colors C11 to C14 (three of C11 to C14), and theremaining one may produce one of the fourth group colors C11′ to C14′(one of C11′ to C14′). When the plurality of light-emitting chips 200 ato 200 d of FIG. 1 are chips producing the third group colors C11 to C14or the fourth group colors C11′ to C14′, the colors of the plurality ofchips 200 a to 200 d may be combined to realize the target color C0.Although chips corresponding to the third and fourth group colors C11 toC14 and C11′ to C14′ are classified as defective chips in the relatedart, the chips corresponding to the third and fourth group colors C11 toC14 and C11′ to C14′ may be used as good chips in the currentembodiment. As described above, according to an embodiment, since thechips classified as defective chips may be used as good chips,production yield may be improved.

As described above, the number of light-emitting chips may be increasedto more than four. In this case, the light-emitting chips may bepackaged as a multi-chip package having 3×3 matrix, 4×4 matrix, or thelike. An example of the multi-chip package arranged in the 3×3 or 4×4matrix is illustrated in FIGS. 5 and 6. FIG. 5 illustrates a structurein which the light-emitting chips 200 are arranged in the 3×3 matrix,and FIG. 6 illustrates a structure in which the light-emitting chips 200are arranged in the 4×4 matrix.

FIGS. 7A to 7D are views illustrating a method of manufacturing alight-emitting device package, according to an embodiment. FIGS. 7A to7C are sectional views, and FIG. 7D is a plan view.

Referring to FIG. 7A, a plurality of light-emitting cells 20 may beformed on a wafer 10. Although the light-emitting cells 20 are simplyillustrated in the drawings, each of the light-emitting cells 20 mayinclude a structure in which a first conductive type semiconductor, anactive layer, and a second conductive type semiconductor aresequentially stacked. The first conductive type semiconductor may be anN-type semiconductor, and the second conductive type semiconductor maybe a P-type semiconductor, and vice versa. The active layer may be alight-emitting layer in which electrons and holes combine to emit light.Each of the light-emitting cells 20 may further include other materiallayers than the first conductive type semiconductor layer, the activelayer, and the second conductive type semiconductor layer. Also, each ofthe structures of the light-emitting cells 20 may be variously modified.The plurality of light-emitting cells 20 may be a plurality oflight-emitting cell regions, and they may constitute one light emittingstructure layer. That is, the plurality of light-emitting cells 20 maybe a plurality of light-emitting cell regions of a light emittingstructure layer.

A fluorescent layer 30 may be formed on the wafer 10 to cover theplurality of light-emitting cells 20. Since the fluorescent layer 30 isformed at a wafer level, the fluorescent layer 30 may be easily formedwith a uniform thickness on the entire wafer 10.

A top view (plan view) of FIG. 7A may be the same as FIG. 8, forexample. The fluorescent layer 30 of FIG. 7A is not illustrated in FIG.8.

Referring to FIG. 7B, the wafer 10 on which the plurality oflight-emitting cells 20 and the fluorescent layer 30 are formed may bedivided into a cell unit to form a plurality of light-emitting chips200. The plurality of light-emitting chips 200 may have a colorvariation/dispersion due to errors occurring during the productmanufacturing process. That is, although the plurality of light-emittingchips 200 have the same color (e.g., white color), the plurality oflight-emitting chips 200 may have color temperatures and brightnessesdifferent from each other.

Referring to FIG. 7C, the plurality of light-emitting chips 200 may beclassified according to color temperatures. For example, in thisprocess, the plurality of light-emitting chips 200 may be classifiedinto first color groups C1 to C4 according to the color temperatures ofthe plurality of light-emitting chips 200. Here, the plurality of colorgroups C1 to C4 may correspond to the four surrounding colors C1 to C4of FIG. 2. This process may be different from a binning process in anLED manufacturing process.

Referring to FIG. 7D, a plurality of light-emitting chips 200 a to 200 dmay be selected from the plurality of light-emitting chips 200classified into the plurality of color groups C1 to C4 in the formerprocess to mount the selected light-emitting chips 200 a to 200 b on onesubstrate 100. Here, the selected light-emitting chips 200 a to 200 dmay be chips respectively corresponding to the four surrounding colorsC1 to C4 of FIG. 2. Thus, the selected light-emitting chips 200 a to 200d may produce an intermediate color of the four surrounding colors C1 toC4, i.e., a target color C0. The selected light-emitting chips 200 a to200 d may have color temperatures within about ±250K of that of thetarget color C0. A color temperature relationship between the selectedlight-emitting chips 200 a to 200 d and the target color C0 will bedescribed later in detail. Reference numerals 20 a to 20 d and 30 a to30 d of FIG. 7D represent light-emitting cells and fluorescent layers ofthe selected light-emitting chips 200 a to 200 d, respectively.

The colors produced by the selected light-emitting chips 200 a to 200 din FIG. 7D are not limited to the four surrounding colors C1 to C4 ofFIG. 2, but may be variously changed. Since this is already describedwith reference to FIGS. 3 and 4, a duplicate description thereof will beomitted.

Thereafter, although not shown, an encapsulation material, covering thefluorescent layers 30 a to 30 d, may be formed on the substrate 100. Theencapsulation material may be formed of silicon containing a dispersingagent, for example. A lens may be disposed on the encapsulationmaterial.

As described above, according to the embodiment, the light-emittingdevice package, which may reduce the color variation/dispersion betweenthe light-emitting chips and increase productivity, may be manufactured.

In addition, some of the light-emitting chips 200 may be classified intochips capable of producing the target color C0 in the process of FIG.7C. Thus, the light-emitting chips capable of producing the target colorC0 may be separately collected, and then mounted on a substrate. In thiscase, the plurality of light-emitting chips 200 mounted on the substratetogether with each other may also produce the target color C0.

Also, in the process of FIG. 7A, instead of forming a plurality oflight-emitting cells 20 spaced from each other, one “light emittingstructure layer” (stacked structure) may be formed, the light emittingstructure layer may be divided into a plurality of light-emitting cellslater. That is, a light emitting structure layer including a pluralityof light-emitting cell regions may be formed. In this case, afluorescent layer may be formed on the light emitting structure layer asa successive process. Then, the substrate on which the light emittingstructure layer and the fluorescent layer are formed may be divided intoa cell unit to form a plurality of light-emitting chips similar to thoseof FIG. 7B. Thereafter, the processes of FIGS. 7C and 7D may beperformed.

Hereinafter, a color temperature relationship between the plurality oflight-emitting chips 200 a to 200 d selected in the current embodimentand the target color C0 will be briefly described.

The plurality of light-emitting chips 200 a to 200 d selected in thecurrent embodiment may have color temperatures within about ±250K ofthat of the target color C0. The fact that the plurality oflight-emitting chips 200 a to 200 d have the color temperatures withinabout ±250K of that of the target color C0 may mean the fact that thecolor temperatures of the plurality of light-emitting chips 200 a to 200d are within a MacAdam 7-step with respect to the target color C0. Colortemperatures of light-emitting chips randomly selected in a typicalprocess may be outside of the MacAdam 7-step with respect to a centralcolor (i.e., target color). Also, since the color temperatures of theselected light-emitting chips in the typical process are randomlylocated in position, it may be difficult to secure superior quality.However, like the current embodiment, when the condition of the MacAdam7-step, i.e., the condition in which the plurality of selectedlight-emitting chips have the color temperatures within, i.e., about±250K of that of the target color C0 is satisfied, and when theplurality of selected light-emitting chips produce the colors around thetarget color C0, the superior quality may be easily obtained.

While the inventive concept has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be understoodby those of ordinary skill in the art that various changes in form anddetails may be made therein without departing from the spirit and scopeof the inventive concept as defined by the following claims. Forexample, it is obvious to one of ordinary skill in the art that thestructures of the light-emitting device packages and manufacturingmethods thereof according to embodiments of the present invention may bevariously modified. Also, the idea of the inventive concept may beequally applied to light-emitting devices producing different colorsexcept for a white light-emitting device. Therefore, the scope of theinventive concept is defined not by the detailed description of theinventive concept but by the appended claims.

1-14. (canceled)
 15. A light-emitting device package comprising: asubstrate; and a plurality of light-emitting chips disposed on thesubstrate, wherein the plurality of light-emitting chips produce colorsaround a target color, and the colors around the target color have thesame hue as the target color and color temperatures different from thatof the target color, wherein the target color is produced bycombinations of the colors of light emitted from the plurality oflight-emitting chips, and wherein the target color is in a first rankregion, and at least one of the colors of light emitted from theplurality of light-emitting chips is outside of the first rank region.16. The light-emitting device package of claim 15, wherein one of thecolors of light emitted from the plurality of light-emitting chips is ina second rank region which is adjacent to the first rank region.
 17. Thelight-emitting device package of claim 16, wherein another one of thecolors of light emitted from the plurality of light-emitting chips is ina third rank region, the first rank region is between the second rankregion and the third rank region.
 18. The light-emitting device packageof claim 15, wherein one of the colors of light emitted from theplurality of light-emitting chips has a color coordinate point above thefirst rank region.
 19. The light-emitting device package of claim 18,wherein another one of the colors of light emitted from the plurality oflight-emitting chips has a color coordinate point below the first rankregion.
 20. The light-emitting device package of claim 15, wherein theplurality of light-emitting chips have color temperatures within about±250K of that of the target color.
 21. The light-emitting device packageof claim 15, wherein the target color is a color corresponding to acentral portion of the first rank region.
 22. The light-emitting devicepackage of claim 15, wherein the plurality of light-emitting chips arearranged in an N×N matrix, where N is a natural number equal to orgreater than two.
 23. The light-emitting device package of claim 15,wherein the light-emitting device package is a white light-emittingdevice package.
 24. A light-emitting device package comprising: asubstrate; and a plurality of light-emitting chips disposed on thesubstrate, wherein the plurality of light-emitting chips produce colorsaround a target color, and the colors around the target color have thesame hue as the target color and color temperatures different from thatof the target color, wherein the target color is produced bycombinations of the colors of light emitted from the plurality oflight-emitting chips, wherein the colors of light emitted from theplurality of light-emitting chips includes first through fourth colorswhich have first through fourth color coordinate points, respectively,wherein a first line connecting the first and second color coordinatepoints and a second line connecting the third and fourth colorcoordinate points cross each other.
 25. A method of manufacturing alight-emitting device package, the method comprising: forming a lightemitting structure layer comprising a plurality of light-emitting cellregions on a wafer; forming a fluorescent layer covering the pluralityof light-emitting cell regions on the wafer; separating the wafer onwhich the plurality of light-emitting cell regions and the fluorescentlayer are formed into a cell unit to form a plurality of light-emittingchips; classifying the plurality of light-emitting chips according tocolor temperatures thereof; and selecting a plurality of chips among theplurality of light-emitting chips and packaging the selectedlight-emitting chips on a substrate, wherein the selected light-emittingchips produce colors around a target color, the target color is in afirst rank region, and at least one of the colors from the selectedlight-emitting chips is outside of the first rank region.
 26. The methodof claim 25, wherein one of the colors from the selected light-emittingchips is in a second rank region which is adjacent to the first rankregion.
 27. The method of claim 26, wherein another one of the colorsfrom the selected light-emitting chips is in a third rank region, thefirst rank region is between the second rank region and the third rankregion.
 28. The method of claim 25, wherein one of the colors from theselected light-emitting chips has a color coordinate point above thefirst rank region.
 29. The method of claim 28, wherein another one ofthe colors from the selected light-emitting chips has a color coordinatepoint below the first rank region.
 30. The method of claim 25, whereinthe selected light-emitting chips have color temperatures within about±250K of that of the target color.
 31. The method of claim 25, whereinthe target color is a color corresponding to a central portion of thefirst rank region.